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Sn-Zn合金在Si3N4/2024Al复合材料表面渗锡行为

Sn behavior over Si3N4/2024Al composite surface in wetting test of Sn-Zn alloy

  • 摘要: 采用Sn-Zn合金对Si3N4体积分数为45%的Si3N4/2024Al复合材料进行不同温度下真空润湿试验.结果表明,试验后的母材表面形成厚度较大的锡扩散层,并且随着温度的逐步升高,扩散层厚度随之增加,在温度为530℃时,锡扩散层厚度高达1300μm,然而当温度低于330℃时,母材表面无法形成锡的扩散.文中通过5个对比试验并结合杨氏方程和空洞理论详尽分析了这种渗锡行为的原理.验证得出真空中锌的挥发和母材中第二相增强颗粒的存在是完成渗锡行为的必要条件.

     

    Abstract: Sn-Zn alloy is employed to conduct wetting tests over Si3N4/2024Al composite (45% Si3N4) in vacuum under different temperatures.On surface of the composite formed a thick Sn diffusion layer,and then the layer grows thicker as temperature increases.At 530℃,Sn diffusion layer thickness reached 1300 μm,while diffusion is not observed when temperature is below 330℃.Sn diffusion mechanism was studied based on Young's equation and cavity theory by five groups contrast tests.The results indicated that the volatilization of Zn in vacuum and second phase strengthening particles are necessary to accomplish Sn layer.

     

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