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Al-Ni-CuO中间层自蔓延连接Cf/Al与TiAl接头的微观形貌及其形成机制

Formation mechanism and microstructure of Cf/Al and TiAl joint by SHS joining with Al-Ni-CuO interlayer

  • 摘要: 采用14Al-2Ni-3CuO中间层真空加热实现了Cf/Al复合材料与TiAl合金的自蔓延连接,获得了良好的接头.分析了Al-Ni-CuO粉末中间层的DTA曲线,研究了其放热机制,阐述了接头界面的形成过程.结果表明,加热温度升高到500℃,铝与CuO即发生氧化还原反应,放出大量的热;加热温度升高到600℃左右,中间层局部的实际温度已经超过了铝的熔点,铝开始熔化,液态铝将固态镍包围,铝与镍发生反应,生成NiAl3.在最终接头的TiAl侧,中间层与TiAl生成TiAl3;在Cf/Al侧,中间层与Cf/Al生成NiAl3;中间层中的镍向Cf/Al复合材料中扩散,与铝基体发生反应生成NiAl3.

     

    Abstract: Cf/Al composites and TiAl alloys were joined by SHS joining with Al-Ni-CuO interlayer in the vacuum furnace.High quality joint was obtained.DTA curve of Al-Ni-CuO interlayer was analyzed.Heat production mechanism of Al-Ni-CuO interlayer was analyzed and the interface formation of Cf/Al and TiAl joint was introduced.The result showed that Al atoms react with CuO when the temperature rises to 500℃,and release a large quantity of heat.When the heating temperature reaches 600℃,the real temperature on local part of interlayer has already achieved the melting point of Al.Al starts to melt.The liquid Al surrounds the solid Ni,and reacts with each other to form NiAl3.In final joint,TiAl3 layer forms on the interface of TiAl and Al- Ni-CuO interlayer.NiAl3 appears on the interface of Cf/Al and Al-Ni-CuO interlayer.In the Cf/Al,Ni in Al-Ni-CuO layer diffuses toward to Cf/Al and forms NiAl3.

     

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