含纳米铝颗粒SnAgCu钎料组织与性能
Microstructure and properties of SnAgCu solders bearing Al nano-particles
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摘要: 选择在SnAgCu钎料中添加纳米铝颗粒,改善无铅钎料的性能.结果表明,微量纳米铝颗粒可以增加SnAgCu钎料的润湿铺展面积,显著提高SnAgCu焊点的拉伸力和剪切力,添加过量时钎料的润湿性能会有一定程度的下降,经过优化分析发现纳米铝颗粒的最佳添加量应该控制在0.1%附近.对SnAgCu-xAl钎料的组织分析,发现纳米颗粒的添加,钎料组织得到明显的细化,树枝晶间距明显减小.对SnAgCu-xAl焊点进行蠕变拉伸测试,发现纳米铝颗粒可以显著提高SnAgCu焊点的蠕变断裂寿命,主要归因于纳米颗粒对位错的钉扎作用.Abstract: Al nano-particles were added into the SnAgCu solder to improve the properties. The results indicate that adding small amount of nano-particles can enhance the wettability of the SnAgCu solder,and the mechanical properties of the soldered joints can be improved significantly. However,excessive nanoparticles would reduce the wettability of the solder,and the optimum nano-particles content was about 0.1wt% for the SnAgCu solder. Based on the microstructure examination,it was found that adding nano-particles could obviously refine the microstructure and reduce the dendrite-arm spacing of SnAgCu-xAl solders. In addition, the creep tensile test for the joint made with SnAgCu-xAl solder revealed that the nano-particles could significantly improve the creep rupture life by pinning the dislocations.
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Keywords:
- nano-particles /
- lead free solder /
- mechanical property /
- creep rupture life
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期刊类型引用(4)
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3. 陈金选，刘继常. 多激光束与中轴热丝复合沉积（熔覆）结合的新工艺. 激光与光电子学进展. 2019(24): 162-166 . 百度学术
4. 李治，吴艳明，陈宇. 扫描激光-热丝焊接过程焊丝熔入行为分析. 材料开发与应用. 2017(03): 11-15 . 百度学术
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