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王欢, 杨平, 谢方伟, 席涛. 复合加载下焊点寿命的数值模拟[J]. 焊接学报, 2012, (12): 65-68.
引用本文: 王欢, 杨平, 谢方伟, 席涛. 复合加载下焊点寿命的数值模拟[J]. 焊接学报, 2012, (12): 65-68.
WANG Huan, YANG Ping, XIE Fangwei, XI Tao. Study on life-prediction of solder joint under combined loading[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (12): 65-68.
Citation: WANG Huan, YANG Ping, XIE Fangwei, XI Tao. Study on life-prediction of solder joint under combined loading[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (12): 65-68.

复合加载下焊点寿命的数值模拟

Study on life-prediction of solder joint under combined loading

  • 摘要: 提出一种在温度和振动复合加载条件下焊点寿命的预测方法.基于有限元法分别得到温度加载和振动加载条件下焊点的变形量,将此焊点变形量作为多轴加载的边界条件,研究多轴加载条件下的焊点的应力应变情况,并以此预测焊点的寿命.结果表明,焊点寿命在同一温度下可根据振动幅值的大小分为三个区域,在区域Ⅰ内焊点寿命受温度影响较大,在区域Ⅱ内温度和振动加载的相互影响现象最为明显,在区域Ⅲ内焊点受振动幅值的影响较大.理论预测结果与试验测试结果的趋势很好的吻合.

     

    Abstract: A life-prediction approach of solder joints under combined thermal and vibration loading is provided in this paper.The deformations of solder joints are calculated respectively under vibration and thermal cycling loading based on finite element method.The calculated results are defined as boundary conditions of the multiaxial loading to investigate the strain/stress of the solder joints.Then the life of solder joints is calculated.The result reveals that the life of solder joints can be divided into three regions according to the vibration amplitude at the same temperature: the life of solder joints in region Ⅰ is affected by thermal loading;that in region Ⅱ is greatly affected by the combined loading;that in region Ⅲ is affected by the vibration amplitude.The trend of the simulation results basically agrees with that of the test results.

     

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