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用非晶钎料加铜层连接Si3N4的界面结构与强度

Interfacial structure and strength of Si3N4 ceramics joint brazed with amorphous filler metal and Cu layer

  • 摘要: 采用TiZrCuB非晶钎料和铜箔中间层连接Si3N4陶瓷,研究了钎料成分和铜箔厚度对接头界面结构和抗弯强度的影响.结果表明,采用Ti40Zr25CuB0.2非晶钎料和70!m铜箔中间层,在1 323 K×30 min和0.027 MPa压力下连接Si3N4陶瓷,其接头抗弯强度最高为241 MPa;Si3N4陶瓷连接接头界面反应层为TiN,界面微观结构为Si3N4/TiN/Ti-Si+α-Cu+Ti-Zr+Cu-Zr;改变中间层厚度可以调整反应层的结构和厚度;随铜箔厚度增加,Ti-Si化合物层逐渐脱离TiN层被推向钎缝中心并细化呈颗粒状.

     

    Abstract: Si3N4 ceramics were brazed with TiZrCuB amorphous filler metal and Cu interlayer, the effect of brazing metal compositions and thickness of copper foil on interfacial structure and bonding strength were studied in this paper.The result shows that the joint strength is up to 241 MPa when the brazing temperature is 1 323 K, holding time is 30 min, the thickness of Cu interlayer is 70 μm and the exerted pressure is 0.027 MPa.The reaction layer is TiN and the interface microstructure is compound of Si3N4/TiN/Ti-Si+Ti-Zr+Cu-Zr+α-Cu.Changing the thickness of interlayer can adjust the thickness and compositions of the reaction layer.As the thickness of Cu interlayer increased, Ti-Si compound layer was gradually separated from the TiN layer, and was pushed into the weld center and refined to a granular shape.

     

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