Sn-Zn系钎料专用助焊剂

Development of flux for Sn-Zn lead-free solder

摘要: 采用铺展试验法研究了Sn-9Zn钎料配合自制Sn-Zn系钎料专用助焊剂、NH₄Cl-ZnCl₂助焊剂、树脂型助焊剂以及水溶性助焊剂在铜板上的铺展能力.结果表明,使用自制助焊剂A4匹配Sn-9Zn钎料铺展性能相比其它助焊剂铺展面积明显增大.自制助焊剂不含卤素,钎料的铺展面积最大为65.7 mm²,相比NH₄Cl-ZnCl₂助焊剂、树脂型助焊剂、水溶性助焊剂分别提高了16.1%,116.1%,85.1%.此外,复配助焊剂能进一步促进钎料在铜板上的铺展,最大铺展面积分别达到76.5,72.5 mm²,控制磺酸亚锡的含量为20%(质量分数),二乙醇胺,丁二酸的最佳添加量依次为8%,10%(质量分数).

Abstract: The speadabitity of Sn-9Zn solder on Cu substrate with four different types of flux was studied by spreading experiment method.The experimental results indicated that Sn-9Zn solder, matching the flux-A4 with stannous sulfonate(20%) as the main activator without halogen which exhibited excellent wettability.The largest spreading area was 65.7 mm², increased respeetively by 16.1%, 116.1%, 85.1% compared with the NH₄Cl-ZnCl₂, resin and water-solubility fluxes.Besides, the newly developed flux with combination of 20% stannous sulfonate and diethanolamine, succinic acid could remarkably improve the wettabiltiy of Sn-9Zn solder that the largest spreading areas were 76.5 mm², 72.5 mm² when the contents of diethanolamine, succinic acid were at 8%, 10%.