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TiNi-V共晶钎料钎焊Si3N4陶瓷接头界面结构及性能

Interfacial microstructure and properties of Si_3N_4 joints brazed using TiNi-V eutectic brazing alloy

    摘要
  • 摘要: 采用真空电弧熔炼技术制备了TiNi-V高温共晶钎料合金,研究了该钎料在Si3N4陶瓷表面的铺展行为.随后采用TiNi-V钎料实现了Si3N4陶瓷的钎焊连接,利用SEM,EDS以及XRD等分析方法,确定了接头的典型界面结构为:Si3N4/TiN+Ti-Si化合物/NiV.重点研究了钎焊温度对接头界面结构及力学性能的影响.结果表明,随着钎焊温度的升高,熔融钎料与Si3N4陶瓷反应程度增加,导致钎缝中TiN+Ti-Si化合物层厚度不断增加,且在接头残余应力的作用下形成了大量显微裂纹,降低了接头性能.当钎焊温度为1 200℃,钎焊时间为10 min时,接头室温抗剪强度达到最大为28 MPa.断口分析显示接头断裂于TiN+Ti-Si化合物层为脆性断裂.

     

    Abstract: TiNi-V eutectic brazing alloy was fabricated by vacuum arc melting, and its spreadability on the surface of Si3N4 ceramic was investigated.The brazing of Si3N4 ceramic was achieved using TiNi-V brazing alloy.The typical interfacial microstructure was Si3N4/TiN+Ti-Si compounds/NiV.The effect of brazing temperature on the interfacial microstructure and properties of joints was investigated.The results showed that with the increasing of brazing temperature, the reaction between molten brazing alloy and Si3N4 ceramic intensified and the thickness of TiN+Ti-Si compounds layer increased gradually.Moreover, lots of microcracks were formed in the joints due to the residual stress in joints, which deteriorated the joining properties.The highest shear strength of 28 MPa was obtained when the specimen was brazed at 1 200℃ for 10 min.The joint fractured in TiN+Ti-Si compounds layer, which belonged to brittle fracture.

     

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