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TiAl/Ti/Nb/GH99扩散连接接头的界面组织结构及接头强度

Interfacial microstructure and bonding strength of diffusion bonded TiAl/Ti/Nb/GH99 alloy joint

  • 摘要: 采用Ti/Nb复合中间层对TiAl与镍基高温合金(GH99)进行扩散连接.采用扫描电镜、电子探针和X射线衍射等手段对连接接头的生成相及界面组织结构进行分析,采用抗剪强度测试对接头的连接强度进行评价.结果表明,GH99/Nb/Ti/TiAl的典型界面结构为GH99/(Ni,Cr)ss/Ni3Nb/Ni6Nb7/Nb/(Ti,Nb)ss/α-Ti+(Ti,Nb)ss/Ti3Al/TiAl.当连接温度为900℃,连接时间为30 min,连接压力为20 MPa时,所得接头抗剪强度最高为273.8 MPa.随着连接温度的升高,界面组织结构及反应层厚度发生变化.当连接温度T > 900℃时,界面处生成对接头强度有不利影响的Ni6Nb7反应层;根据试验结果,进一步分析了各反应层的形成过程,揭示了GH99/Nb和Nb/Ti/TiAl的界面扩散反应机制.

     

    Abstract: Diffusion bonding of TiAl-based alloy to Ni-based alloy using Ti/Nb composite interlayer was carried out.The formation phases and the interfacial microstructure of the joints were investigated by scanning electron microscopy, electron probe X-ray analysis and X-ray diffraction.The bonding strength of the joints was evaluated through shear test.The results show that the typical interfacial microstructure of the joint is GH99/(Ni, Cr)ss/Ni3Nb/Ni6Nb7/(Ti, Nb)ss/α-Ti+(Ti, Nb)ss/Ti3Al/TiAl.The maximum shear strength of 273.8 MPa can be achieved under the condition of T=900℃ for t=30 min and p=20 MPa.With the joining temperature T increasing, the interfacial microstructure and thickness of reaction layer changes.When the brazing temperature T > 900℃, Ni6Nb7 reaction layer which has bad effect on the bonding strength forms.Based on the experimental results, the formation process of reaction layer was analyzed and interfacial reaction mechanism of the interface of GH99/Nb and Nb/Ti/TiAl was revealed.

     

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