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皋利利, 薛松柏, 王博. 稀土元素Nd对Sn3.8Ag0.7Cu焊点组织与抗剪强度的影响[J]. 焊接学报, 2011, (12): 73-76.
引用本文: 皋利利, 薛松柏, 王博. 稀土元素Nd对Sn3.8Ag0.7Cu焊点组织与抗剪强度的影响[J]. 焊接学报, 2011, (12): 73-76.
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GAO Lili, XUE Songbai, WANG Bo. Effect of Nd addition on microstructure and mechanical property of Sn3.8Ag0.7Cu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (12): 73-76.
Citation: GAO Lili, XUE Songbai, WANG Bo. Effect of Nd addition on microstructure and mechanical property of Sn3.8Ag0.7Cu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (12): 73-76.
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稀土元素Nd对Sn3.8Ag0.7Cu焊点组织与抗剪强度的影响

Effect of Nd addition on microstructure and mechanical property of Sn3.8Ag0.7Cu solder joint

    摘要
  • 摘要: 研究了微量稀土元素Nd(0,0.05,0.5质量分数,%)的添加对Sn3.8Ag0.7Cu/Cu焊点再流焊与150℃时效条件下焊点组织与抗剪强度的影响.结果表明,适量Nd(0.05%)的添加可以明显增强微焊点的抗剪强度,改善焊点组织;降低时效过程中SnAgCu/Cu焊点界面化合物生长速率以及焊点内部基体中Cu6Sn5化合物的颗粒粗化速率,从而有利于提高微焊点长期服役过程中的可靠性.时效过程中,SAC-0.05Nd焊点力学性能下降速率较SAC焊点有所降低,而SAC-0.5Nd焊点由于稀土化合物NdSn3相的粗化,与SAC微焊点力学性能下降速率无明显差异.

     

    Abstract: The effects of Nd addition(0, 0.05, 0.5wt%) on the microstructure and shear strength of SAC solder joint under as-reflowed and 150℃ isothermal-aging process were investigated. Experimental results showed that Nd addition can obviously improve the shear strength and microstructure of the SAC solder joints. The growth rate of the SAC/Cu interfacial layer as well as the coarsen rate of Cu6Sn5 particles in the Sn matrix during aging process was both restrained by Nd addition, which would enhance the reliability of the solder joint during service process. Moreover, during aging process, the shear strength reduction rate of SAC-0.05Nd solder joint was lower than that of SAC, but the shear strength reduction rate of SAC-0.5Nd solder joint showed no obvious difference compared with that of SAC because of the coarsen of NdSn 3 phase in aging process.

     

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