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SnZn系无铅钎料性能对比分析

Compared study on properties of SnZn-based lead free solders

  • 摘要: 对比研究了4种SnZn系无铅钎料的润湿性、抗蠕变性能以及力学性能.结果表明,SnZnAg/SnZnGa/SnZnAl的润湿性均高于SnZn钎料,合金元素的添加可以显著提高SnZn钎料的润湿性;SnZnAg钎料的抗蠕变性能最高,这主要是因为Ag-Zn金属间化合物颗粒钉扎位错引起的;合金元素的添加可以显著提高SnZn焊点的力学性能和抗疲劳特性,银的加入可以使SnZn焊点的力学性能提高近20%,Ga/Al的提高幅度相对较小.另外采用激光再流焊方法,SnZn系焊点的力学性能可以提高近16.7%.文中研究成果可以为SnZn无铅钎料提供理论支撑.

     

    Abstract: The wettability,creep resistance and mechanical properties of four SnZn-based solders were compared. Base on the wetting-balance test,the wettability of SnZnAg/SnZnGa/SnZnAl is better than SnZn solders. The addition of alloying elements can improve the wettability of SnZn alloys. With the testing of nanoindentation creep behavior of SnZn solders,it is found that the creep resistance of SnZnAg solder is highest of all, the mechanism is Ag-Zn particles acting as barriers to the motion of dislocations. In addition,with the testing of mechanical properties,the results show that the mechanical and thermal-fatigue resistance properties can be enhanced with the addition of alloying elements,the mechanical properties of SnZnAg solder joints is 20% higher than that of SnZn solder joints,the function of Ga/Al is less than Ag. Furthermore,using diode laser soldering,the mechanical properties of SnZn solder joints can increase up to 116.7%.

     

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