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含碳纳米管的Sn-58Bi钎料的制备及其钎焊性

Investigation preparation method and soldering behaviors of Sn-58Bi lead-free solder with carbon nanotubes

  • 摘要: 采用球磨-低温冶炼法制备了不同碳纳米管含量的Sn-58B i-CNTs钎料,借助SEM,EDS和DSC等分析手段研究了碳纳米管在钎料合金中的形态以及碳纳米管对Sn-58B i合金焊点拉脱强度的影响.结果表明,经过钎料低温冶炼后,碳纳米管能够部分加入到Sn-58B i合金中形成复合钎料;Sn-58B i-0.03%CNTs复合钎料在焊盘上的润湿性得到了提高,且微量碳纳米管的加入对钎料熔点的影响不大;碳纳米管在焊点中弥散分布使钎料的组织得到细化,并通过对焊点微观断裂机制的影响,提高焊点的可靠性.

     

    Abstract: Varying weight fraction of multi-walled carbon nanotubes were incorporated into Sn-58Bi soler alloy by ball-milling and low temperature melting methods, the morphologies of carbon nanotubes in solder alloy and the influences of carbon nanotubes on the pull-off strength were investigated by SEM, EDS, and DSC. The experimental results indicate that part of carbon nanotubes are incorporated into Sn-58Bi soler alloy after ball-milling and low temperature melting; 0.03% CNTs can improve the wettability; the melting point of Sn-58Bi-CNTs solder does not change much; the dispersive distribution of carbon nanotubes could refine the microstructure of Sn-58Bi-CNTs joints and the reliability of solder joints also is improved by the influences of CNTs on the fracture mechanism of solder joints.

     

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