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薛鹏, 薛松柏, 沈以赴, 叶焕, 肖正香. Sn-9Zn-xPr钎料钎焊性能及显微组织[J]. 焊接学报, 2011, (8): 53-56.
引用本文: 薛鹏, 薛松柏, 沈以赴, 叶焕, 肖正香. Sn-9Zn-xPr钎料钎焊性能及显微组织[J]. 焊接学报, 2011, (8): 53-56.
XUE Peng, XUE Songbai, SHEN Yifu, YE Huan, XIAO Zhengxiang. Solderability and microstructure of Sn-9Zn-xPr lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (8): 53-56.
Citation: XUE Peng, XUE Songbai, SHEN Yifu, YE Huan, XIAO Zhengxiang. Solderability and microstructure of Sn-9Zn-xPr lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (8): 53-56.

Sn-9Zn-xPr钎料钎焊性能及显微组织

Solderability and microstructure of Sn-9Zn-xPr lead-free solder

  • 摘要: 研究了稀土元素Pr的添加量对Sn-9Zn无铅钎料的润湿性能、显微组织和焊点力学性能的影响.结果表明,镨的加入不仅改善了钎料的润湿性能和抗氧化性能,而且细化了钎料基体中的富锌相,使得界面组织更为稳定,有利于焊点可靠性的改善;Sn-9Zn无铅钎料中镨的添加量为质量分数0.08%时,钎料的润湿性能最佳,综合性能最好;当镨的添加量达到并超过质量分数0.1%时,Sn-9Zn组织内出现了大量的Sn-Pr化合物,导致了钎料中锡须的生长.

     

    Abstract: The effects of Pr on the wettability of Sn-9Zn lead-free solder and the mechanical properties of soldered joints are investigated and the results indicate that with the addition of rare earth Pr into Sn-9Zn solder, the microstructure is refined obviously, Zn-rich phrase is decreased and mechanical properties improved. The best wettability and mechanical property of soldered joint is obtained when the content of Pr is 0.05 wt.%. Moreover, when the content of Pr is exceeded 0.1 wt.%, plenty of Sn-Pr compounds are found in the Sn-9Zn solder, which lead to the growth of whiskers.

     

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