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黄超, 林铁松, 何鹏, 顾小龙. TiBw/TC4钛合金与C/C复合材料钎焊接头的界面组织结构[J]. 焊接学报, 2011, (7): 39-42.
引用本文: 黄超, 林铁松, 何鹏, 顾小龙. TiBw/TC4钛合金与C/C复合材料钎焊接头的界面组织结构[J]. 焊接学报, 2011, (7): 39-42.
HUANG Chao, LIN Tiesong, HE Peng, GU Xiaolong. Microstructure of TiBw/TC4 alloy and C/C composite brazed joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (7): 39-42.
Citation: HUANG Chao, LIN Tiesong, HE Peng, GU Xiaolong. Microstructure of TiBw/TC4 alloy and C/C composite brazed joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (7): 39-42.

TiBw/TC4钛合金与C/C复合材料钎焊接头的界面组织结构

Microstructure of TiBw/TC4 alloy and C/C composite brazed joint

  • 摘要: 采用活性钎料TiZrNiCu对TiBw/TC4钛合金和C/C复合材料进行了钎焊连接,借助SEM,EDS,XRD等分析手段研究了钎焊工艺参数对接头界面组织结构的影响.结果表明,采用TiZrNiCu钎料可以实现对两种材料的连接,接头典型的界面结构为:C/C复合材料/TiC+(Ti,Zr)2(Cu,Ni)/Ti(s,s)+(Ti,Zr)2(Cu,Ni)/TiBw/TC4钛合金.随着连接温度的升高或保温时间的延长,钎焊接头界面生成产物的种类并没有发生改变,但C/C复合材料侧TiC反应层逐渐变得连续且厚度逐步增加,α-Ti枝状晶变得粗大且数量增多,Ti(s,s)+(Ti,Zr)2(Cu,Ni)层逐渐变宽,(Ti,Zr)2(Cu,Ni)逐步分散在Ti(s,s)中.

     

    Abstract: The active filler containing TiZrNiCu was used to join TiBw/TC4 alloy and C/C composite. The effect of the brazing parameters on the interfacial microstructure was studied by SEM, EDS, and XRD. The results show that the typical interfacial structure of the joint is C/C composites/TiC +(Ti,Zr)2(Cu,Ni)/Ti(s,s) +(Ti, Zr)2(Cu, Ni)/TiBw/TC4 alloy. With the increasing of brazing temperature or holding time, the type of the interfacial products in the brazing joint did not change, but the reaction layer of TiC near the C/C composites became continuous and thickness gradually increased, α-Ti dendrites became thicker and the number increased. The layer of Ti(s, s) +(Ti, Zr)2(Cu, Ni) became wider, the phase(Ti, Zr)2(Cu, Ni) gradually dispersed in Ti(s,s).

     

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