考虑定位误差的PCB焊点检测方法

基金项目: 国家杰出青年科学基金资助项目(50825504);NSFC-广东联合基金(U0934004)资助项目;中央高校基本科研业务费专项资金资助(2009ZM0073/2009ZM0132)

Solder joint inspection method regarding misalignment

School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China

摘要: 定位误差会对AOI检测算法的性能产生影响.通过试验,定量研究了定位误差与误判率之间的关系.在现有AOI检测算法的基础上,提出在焊点统计学习阶段,通过对在位置、角度和尺度上存在定位误差的虚拟样本进行学习,使得系统能够学习到可能的定位误差.在评价AOI算法时,将定位误差考虑进来,定义了综合误判率作为AOI算法的性能评价方法.结果表明,文中的方法对定位误差有一定的鲁棒性,可以降低系统的误判率,且检测时间保持不变.
- 自动光学检测 /
- 定位误差 /
- 虚拟样本 /
- 焊点检测
Abstract: Misalignment degrades the performance of inspection algorithms. Misalignment problem of solder joint inspection is investigated quantitatively through evaluating the current algorithm's sensitivity to misalignment. A new learning method is proposed in which a set of virtual samples generated by perturbing the original samples on position, angle and scale are used for training. Synthetical false rate is defined to evaluate the performance of the inspection algorithm regarding misalignment. The experiment results showed that the proposed method is robust to the misalignment while the time cost remains unchanged.
- automatic optical inspection /
- misalignment /
- virtual samples /
- solder joint inspection