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杜长华, 尹立孟, 苏鉴, 陈方, 赵海建. 铋和磷元素对Sn-Zn-RE电子微连接钎料组织与性能的影响[J]. 焊接学报, 2011, (7): 17-20.
引用本文: 杜长华, 尹立孟, 苏鉴, 陈方, 赵海建. 铋和磷元素对Sn-Zn-RE电子微连接钎料组织与性能的影响[J]. 焊接学报, 2011, (7): 17-20.
DU Changhua, YIN Limeng, SU Jian, CHEN Fang, ZHAO Haijian. Influence of Bi and P additions on microstructure and mechanical properties of Sn-Zn-RE solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (7): 17-20.
Citation: DU Changhua, YIN Limeng, SU Jian, CHEN Fang, ZHAO Haijian. Influence of Bi and P additions on microstructure and mechanical properties of Sn-Zn-RE solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (7): 17-20.

铋和磷元素对Sn-Zn-RE电子微连接钎料组织与性能的影响

Influence of Bi and P additions on microstructure and mechanical properties of Sn-Zn-RE solder

  • 摘要: 制备了含不同Bi,P元素的(Sn-9Zn0.05Ce)xBi和(Sn-9Zn0.05Ce)xP钎料合金,观察并分析了钎料的显微组织形貌,测试了钎料的抗拉强度、断后伸长率以及维氏硬度.结果表明,添加Bi元素能显著提高Sn-9Zn0.05Ce钎料合金的抗拉强度和硬度,但同时会明显降低其断后伸长率,而添加微量P元素对钎料的抗拉强度与硬度没有明显的影响.此外,添加Bi和P元素均能促使钎料析出针状或颗粒状富锌相,富锌相随Bi或P元素添加量的增加而增多,并因此影响钎料合金的力学性能.

     

    Abstract: The Sn-9Zn0.05Ce lead-free solder with Bi and P additions were prepared, and microstructure, tensile strength, elongation and Vickers hardness of the lead-free solders were studied. Experimental results show that the tensile strength and hardness increase with more Bi addition in Sn-9Zn0.05Ce lead-free solder, while the elongation decreases with Bi addition. P addition in Sn-9Zn0.05Ce lead-free solder does not obviously affect the tensile strength and hardness. In addition, either Bi or P addition in Sn-9Zn0.05Ce lead-free solder would make Zn separate out from Sn-9Zn0.05Ce lead-free solder more easily, and needle-like or grain-like Zn-rich phase can be found in the solder. Moreover, Zn-rich phase increases with more Bi or P additions in the solder, and accordingly has a great effect on the mechanical properties of Sn-9Zn0.05Ce solder.

     

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