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扩散时间对DD6单晶高温合金TLP接头界面组织的影响

Effect of diffusion time on interfacial microstructure of TLP joints of DD6 single crystal superalloy

  • 摘要: 采用厚度30μm的商用BNi2钎料为中间层,在钎焊温度1100℃,保温时间20 min条件下实现了DD6单晶高温合金的TLP连接.研究了在温度1180℃不同扩散时间对DD6单晶高温合金TLP接头界面组织的影响规律,重点分析了接头区域合金元素随扩散时间的分布规律.结果表明,随着扩散时间的延长,接头界面处形成的针棒状硼化物逐渐溶解并消失;长时间扩散后,DD6母材中γ'相不断长大并相互连接,形成网状组织;Al,Si元素经16 h扩散处理后在焊缝和母材中基本实现均匀化,Co,Cr元素由于扩散速度较小,均匀化程度较差,而W,Re是难熔合金元素,由于其扩散速率最小,很难实现其在接头区域的均匀化.

     

    Abstract: Transient liquid phase diffusion bonding of DD6 single crystal superalloy was achieved using 30μm thick BNi2 filler foil as interlayer at 1100℃/20 min. The effect of diffusion time at 1180℃ on the interfacial microstructure was investigated. The distributions of alloy elements in joint region were analyzed in detail. The results showed that the needle-like boride gradually dissolved and disappeared in the joint region with the extension of diffusion time. After a long time diffusion, γ' phase in DD6 substrate grown and connected to each other, formed net structure. After 16 hours of diffusion, the elements Al and Si in joint and DD6 substrate were homogenized. However, because the diffusion speeds of elements Cr and Co were relatively small, the uniformity degree of Cr and Co in joint and DD6 substrate was obvious. In addition, due to the lowest diffusion speed of elements W and Re, it was difficult to realize their homogenization in joint and DD6 substrate.

     

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