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稀土铈在Sn-Zn无铅钎料表面的高温氧化行为

High-temperature oxidation behavior of cerium on the surface of Sn-Zn lead-free solders

  • 摘要: 通过俄歇电子能谱法和X射线光电子能谱法研究了Sn-9Zn-0.15Ce和Sn-9Zn-0.002Al-0.2Ga-0.25Ag-0.15Ce两种钎料表面Ce元素的分布和存在形式.结果表明,铈在Sn-9Zn-0.15Ce钎料表面0~40 nm范围内的富集区浓度达到30%(原子分数)左右,是基体内部的250倍,主要以CeO2和Ce2O3形态存在.在Sn-9Zn-0.15Ce钎料中复合添加镓和铝后,Ga元素在钎料表面0~6 nm范围内富集,Al元素在表面2~20 nm范围内富集并主要以氧化态形式存在.Ce元素富集在距离钎料表面2~60 nm的范围内,处于Ga,Al元素富集层的下方;由Ga,Al元素富集层构成的致密保护膜可显著降低表面铈被氧化的概率.

     

    Abstract: The distribution and existing form of Ce on the surface of Sn-9Zn-0.15Ce and Sn-9Zn-0.002Al-0.2Ga-0.25Ag-0.15Ce solder are investigated by atomic emission spectrometry and X-ray photoelectron spectroscopy.Results indicate that Ce enriches on the surface of the Sn-9Zn-0.15Ce solder in the range of 0 to 40 nm.The concentration of Ce in the enriched zone is about 30 at.%,which is 250 times of that in the bulk solder,and the enriched Ce on the surface is mostly oxidized as CeO2 and Ce2O3.With the multi-addition of Ga and Al in the Sn-9Zn-0.002Al-0.2Ga-0.25Ag-0.15Ce solder,Ga enriches in range of 0 to 6 nm on the surface,while Al enriches in range of 2 to 20 nm in oxidized form.The Ce-enriched layer is in the range of 2 to 60 nm on the surface covered by the Ga and Al enriched layers,and the oxidation of Ce is depressed significantly.

     

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