真空电阻凸焊过程的有限元模拟分析
Analysis of vacuum projection welding by using finite element procedures
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摘要: 采用真空电阻凸焊进行MEMS器件的封装,可以提高成品率,降低成本.针对MEMS真空电阻凸焊过程建立热、电、结构三场耦合的有限元模型,通过分析得到凸焊筋的压溃过程、焊核的形成过程等一系列结果.结果表明,凸焊筋的压溃主要发生在通电过程的前半部分时间内,而以后的通电时间主要是凸焊筋部分金属熔化,最终形成凸焊焊核的过程.在此基础上分析凸焊筋角度对焊接质量的影响,凸焊筋角度为60°时得到的焊核较大.最后进行焊接以及焊后拉伸试验,试验结果与模拟结果一致.Abstract: Vacuum projection welding process was applied to MEMS package,which could improve yield rate and cut the cost.According to vacuum projection welding process,a thermal-electric-stress coupled field model was established,and the result of projection collapse and nugget growth process was discussed,which showed that the projection collapse occurred in the first half of part-time,then metal around project was melt and final welding nugget was formed.Based on this analysis,the effect of projection tendon angle on welding quality was studied,and the result showed that fine welding quality was achieved when projection tendon angle is 60°.Simulation results agreed with the tensile test results after welding.