Sn-Bi-Cu合金熔体结构变化及对凝固组织影响

陈志浩; 郑伟; 朱协彬; 祖方遒

Sn-Bi-Cu合金熔体结构变化及对凝固组织影响

1.
安徽工程大学高性能有色金属材料重点实验室, 安徽芜湖 241000
2.
合肥工业大学材料学院, 合肥 230009

基金项目: 国家自然科学基金资助项目(50971053);安徽省高校省级自然科学研究资助项目(KJ2010B020);安徽工程科技学院科研启动基金资助项目(2008YQ008);安徽工程科技学院青年基金资助项目(2007YQ010zd)

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- 收稿日期: 2009-08-11

Effects of Sn-Bi-Cu alloy melt structure change on solidification

1.
Anhui Laboratory of High-performance Non-ferrous Metal Materials, Anhui Polytechnic University, Wuhu 241000, China
2.
College of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China

摘要

摘要: 为了探索合金熔体结构与凝固组织间的相关性,进一步改进Sn-Bi-Cu无铅焊料合金组织性能,运用四探针电阻法对Sn₇₀Bi₁₀Cu三元合金的熔体过热行为进行了初步探索.结果表明,升温过程中合金熔体电阻率在812~821℃温度范围内发生了突变,且在降温过程中突变不再发生,表明熔体结构在这一温度区间发生了不可逆的结构转变.通过金相组织观察及力学性能测试发现,该不可逆的转变行为使其凝固组织明显细化及力学性能得到一定的提高:压缩强度极限σ_d提高了约8%,表面维氏硬度提高约18%.
- 熔体结构 /
- 液态结构转变 /
- 无铅焊料
Abstract: In order to explore the correlation between alloy melt structure and solidification structure and to further improve the performance of Sn-Bi-Cu Pb-free solder alloys,the four-probe resistivity method is used to study the melt overheating behavior of Sn₇₀Bi₁₀Cu ternary alloy.The results show that during heating process,a sudden change of electric resistivity will happen in temperature range from 812 to 821℃ but won't during cooling process,which reveals the irreversible structure change in the melts.The results of microstructure observation and mechanical properties testing indicate that the structure change behavior has obvious effects on the solidified microstructure and mechanical properties.The ultimate compressive strength is improved about 8%,and the surface Vickers hardness is improved about 18%.
- melt structure /
- liquid structure change /
- Pb-free solder

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文章访问数: 236
HTML全文浏览量: 2
PDF下载量: 57
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Sn-Bi-Cu合金熔体结构变化及对凝固组织影响

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出版历程

Effects of Sn-Bi-Cu alloy melt structure change on solidification

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出版历程

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