Abstract: To quickly estimate the soldered joint lifetime of the ball grid array package, the analytical model of the simplified stress distribution was founded and the thermal fatigue lifetime was calculated by the creep lifetime prediction model.When the precise results were needed, the three dimensional finite element model was founded and the stress distribution in soldered joint was calculated by Anand constructive function of ANSYS, then the thermal fatigue lifetime was given by the Darveaux model.The analytical method and the finite element method were integrated to a main program by the secondary development function of ANSYS. With this program, the lifetime of the soldered joint can be quickly estimated or precisely predicted with the packaging and soldered joint dimension, material parameters and the thermal cycle parameters.Results of the case show that the analytical model results are more sensitive to the variation of the parameters, while the analyzed results by finite element model are stable.