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等离子喷涂双层热障涂层沉积过程的数值模拟

Numerical simulation on deposition process of duplex thermal barrier coating by plasma spraying

  • 摘要: 运用ANSYS10.0有限元分析软件对等离子喷涂典型双层热障涂层沉积过程的温度和应力变化过程进行了数值模拟.结果表明,喷涂过程中,基体背面温度呈台阶状上升,涂层颗粒的温度大幅度周期波动,涂层颗粒的应力随之大幅度周期波动;喷涂结束后,涂层内的残余应力趋于稳定,x方的最大拉应力存在于陶瓷层与粘结层结合面的边缘;最大y方向拉应力和层间应力都存在于陶瓷层和粘结层的结合面上.涂层的结合面边缘是应力集中部位,结合面的中部应力分布均匀.陶瓷层表面x方的最大拉应力为423.7 MPa.

     

    Abstract: Numerical simulation was performed by finite element analysis(FEA) to investigate the temperature and stress in a typical duplex thermal barrier coating.During the spraying process, the temperature of the back surface of substrate increases step by step, both the temperature and the stress of the coating fluctuate periodically within a wide range.After the deposition, the specimen was cooled to the room temperature slowly.The stresses become constant values, and the maximum radial tensile stress exists at the interface between the ceramic layer and the bonding layer, and the maximum axial and shear stresses exist at the interface, where is the concentrated stress area.The stresses of the middle interfaces are uniform.The maximum tensile stress on the ceramic layer surface is 423.7 MPa.

     

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