锌基合金钎焊界面区的反应机制及组织结构

Reaction mechanism and microstructure of interface in soldered joint of zinc-based alloy

摘要: 采用XRD,EPMA,TEM和SEM等分析测试手段,对用自行研制的钎料和钎剂钎焊的锌基合金钎焊接头界面区微区成分、组织精细结构及物相等进行了分析.结果表明,钎焊接头界面区主要有扩散区和溶解区组成,扩散区中含有较多镉基固溶体(1.44%Zn),溶解区内含有较多的锌基固溶体,整个界面区主要由镉、锡、锌、铝基固溶体及一些氧化物SnO,SnO₂,CdO和金属化合物MgZn,Mg₂Sn,Al₄Cu₉,Mg₂Cu₆Al₅等组成,未发现对钎焊接头性能有严重不利影响的连续状金属化合物层.

Abstract: The micro-region compositisions, fine microstructure and phases of interface region in joint soldered with new solder and flux self-developed were studied by means of XRD, EPMA, TEM and SEM.The results show that the interface region mainly consists of diffusion zone and dissolution zone.There was more Cd based solid solution(1.44% Zn) in diffusion zone, while more Zn based solid solution in dissolution zone.The interface region mainly consists of Cd, Sn, Zn, Al solid solution, and oxides such as SnO, SnO₂, CdO and metallic compounds such as MgZn, Mg₂Sn, Al₄Cu₉ and Mg₂Cu₆Al₅.No continuous intermetallic compounds layer which would seriously impair the properties of the soldered joint is found.