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基于改进光照模型由SFS方法重构SMT焊点三维形状技术

3D reconstruction technology of SMT solder joint by shape from shading based on improved illumination model

  • 摘要: 在采用SFS方法重构SMT焊点三维形状技术中,由于焊点表面镜面反射而在图像中产生的亮点会影响重构形状,从而降低SMT焊点三维重构精度,为此提出一种改进光照模型,该模型不仅对物体表面漫反射分量进行了改进,同时考虑了物体表面镜面反射分量对表面重构所产生的影响,把漫反射分量和镜面反射分量线性叠加,在采用图像处理技术对焊点图像进行适当处理后,利用改进模型对SMT焊点进行三维重构.结果表明,采用改进光照模型与传统光照模型相比,改进光照模型能较好地减少镜面反射对重构结果的影响.

     

    Abstract: Three-dimensional shape and its accuracy are dissatisfactory because of the highlight caused by specular reflection when the shape from shading is used to reconstruct the three-dimensional soldered joint.An improved illumination model is proposed, which can modify the diffuse reflectance component based on the features of image shooting, make a linear superposition for both specular reflection component and diffuse reflectance component.Then the improved illumination model is used to reconstruct the three-dimensional soldered joint after dealing with the soldered joint image by the proper image processing arithmetic.The experimental results show that the 3D shape by SFS based on the improved illumination model is more satisfactory in decreasing specular reflection influence than that of the traditional methods.

     

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