Abstract: An amorphous Cu-P solder was prepared as interlayer for bonding of pure copper.The melting behavior of amorphous solder was investigated.The bonding process for pure copper with amorphous Cu-P interlayer was studied by many means.The results indicate that the bonding process is composed of pre-solid diffusion, spreading and solid diffusion.The amorphous alloy has a good diffusion capability, so the pre-solid diffusion period is performed enough. A little number of liquid metal diffusion happens on the surface of base metal.