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TiNi形状记忆合金与不锈钢TLP-DB接头界面组织及力学性能

Microstructure and properties of transient liquid phase diffusion bonded joint for TiNi shape memory alloy and stainless steel

  • 摘要: 采用AgCu金属箔作中间层,对TiNi形状记忆合金与不锈钢进行了瞬间液相扩散焊.分析了接头的显微组织、元素分布、物相组成等,研究了接头的显微硬度和不同工艺参数下的抗剪强度.结果表明,接头界面区由TiNi侧过渡区、中间区和不锈钢侧过渡区组成,主要相分别为Ti(Cu,Ni,Fe),AgCu,TiFe等.过渡区的显微硬度值高达500~650 HV,但中间区的硬度值只有大约120 HV.随加热温度的升高和保温时间的延长,接头抗剪强度均呈先增大后减小的趋势,最大抗剪强度为239.4 MPa.断裂发生在TiNi母材和AgCu中间层扩散界面上,断口为混合断裂形貌。

     

    Abstract: TiNi shape memory alloy and stainless steel were bonded by transient liquid phase diffusion bonding(TLP-DB)with AgCu metal foil as the interlayer.The microstructure, alloy elements profile and the patterns of joint were analyzed, while the microhardness and the shear strength of the joint were investigated.The results show that the interface zone of joint is composed of TiNi transition zone, middle zone and stainless steel transition zone, which contains Ti(Cu, Ni, Fe)phase, AgCu phase, TiFe phase respectively.The microhardness of diffusion zone in both TiNi side and stainless steel side wries in the range of 500-650 HV.However, the microhardness of middle zone is only about 120 HV.With the increase of heating temperature or the prolonging of the holding time, the shear strength of joint interface increases firstly and then decreases.The highest shear strength is about 239.4 MPa.The fracture occurs at diffusion interface between TiNi alloy and AgCu interlayer, and the joint presents a characteristic of mixed fracture ductile-brittle mode.

     

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