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翟秋亚, 杨金山, 徐峰, 徐锦锋. 急冷Cu-Sn合金的快速凝固焊接接头组织特征[J]. 焊接学报, 2009, (4): 49-52,56.
引用本文: 翟秋亚, 杨金山, 徐峰, 徐锦锋. 急冷Cu-Sn合金的快速凝固焊接接头组织特征[J]. 焊接学报, 2009, (4): 49-52,56.
shu
ZHAI Qiuya, YANG Jinshan, XU Feng, XU Jinfeng. Microstructural characteristic of rapid solidification welding joint of melt-spun Cu-Sn peritectic alloy foils[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (4): 49-52,56.
Citation: ZHAI Qiuya, YANG Jinshan, XU Feng, XU Jinfeng. Microstructural characteristic of rapid solidification welding joint of melt-spun Cu-Sn peritectic alloy foils[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (4): 49-52,56.
shu

急冷Cu-Sn合金的快速凝固焊接接头组织特征

Microstructural characteristic of rapid solidification welding joint of melt-spun Cu-Sn peritectic alloy foils

    摘要
  • 摘要: 应用微型电容储能焊机对厚度约40~60μm的急冷Cu-x%Sn(x=7,13.5,20)合金箔进行了快速凝固焊接.观察了接头的组织形貌,理论计算了微型熔核的冷却速率,分析了熔核中气孔的成因.结果表明,储能焊能够实现急冷Cu-Sn合金箔的快速凝固焊接,形成的焊接接头组织细小致密,具有典型的快速凝固特征.熔核的存在时间仅15.5μs,其平均冷速高达107K/s,接头组织与急冷箔材一致性好.气孔是急冷Cu-Sn合金快速凝固焊接过程中产生的主要缺陷,随着合金中Sn元素含量的增加,熔核中气孔的析出倾向增大。

     

    Abstract: The rapid solidification welding of melt-spun Cu-x%Sn(x=7, 13.5, 20) alloy foils is conducted by a micro-type capacitor discharge welding machine and the microstructural morphology of joint is investigated.The cooling rate of micro nugget is calculated and the formation of porosity in nugget is analyzed theoretically.The results indicate that the capacitor discharge welding can realize the rapid solidification welding of melt-spun Cu-Sn alloy foils.The microstructure of joint is characterized by rapid solidification which consists of fine and homogeneous equiaxed grains.The cooling rate of nugget is up to 107K/s and the welding period is merely 15.5 μs.Therefore, the joint microstructure is in accordance with the rapidly solidified alloy foils.The main welding defect is porosity.With the increase of Sn content, the porosity of nugget increases.

     

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