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活性填料对聚硅氮烷连接SiC陶瓷接头性能的影响

Effect of active filler on joining property of silicon carbide to itself by polysilazane

  • 摘要: 采用陶瓷先驱体聚合物——含乙烯基聚硅氮烷并加入活性填料纳米铝粉连接无压烧结SiC陶瓷。研究了纳米铝粉填料对连接强度的影响,并对连接层的微观结构及成分进行了分析。结果表明,纳米铝粉的加入,促进了聚硅氮烷的裂解,降低了连接温度,减少了连接层内的孔隙等缺陷,从而有效地提高了连接强度。当连接温度为1150℃,加入纳米铝粉填料所获得的连接件经2次浸渍/裂解增强处理后,其室温三点抗弯强度达到最大值为146.8 MPa。XRD分析表明,连接层含有Si3N4,SiC及少量AlN等微粒。微观结构及成分分析显示,连接层厚度约为5μm,元素分布较为均匀,连接层与母材之间接合良好。

     

    Abstract: Joining of pressureless sintering silicon carbide to itself has been realized using vinyl-containing polysilazane with aluminium nanopowders as joining materials.The joining strength of the joints is strongly affected by adding aluminium nanopowders.Addition of aluminium nanopowders as an active addition can effectively accelerate pyrolysis of polysilazane, lower joining temperature and reduce holes and cracks in the joining interlayer.Therefore it can enhance the joining strength.The maximum bending strength of the joints is 146.8 MPa.This value is obtained at the joining temperature of 1150℃ and after the reinforcement for 2 times.XRD study reveals that the joining material has transformed into an amorphous SiCN ceramic and SiC, Si3N4, AlN crystallites.The thickness of interlayer is abaut 5 μm.The joining interlayer is uniform, and the contact at the interfaces is good.

     

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