引线间距对QFP焊点的可靠性影响的有限元分析

盛重; 薛松柏; 张亮; 皋利利

引线间距对QFP焊点的可靠性影响的有限元分析

南京航空航天大学材料科学与技术学院, 南京 210016

基金项目: 江苏省普通高校研究生科技创新计划资助项目(CX07B-087z);2006年江苏省"六大人才高峰"资助项目(06-E-020)

计量
- 文章访问数: 186
- HTML全文浏览量: 3
- PDF下载量: 117
出版历程
- 收稿日期: 2008-01-13

Effect of leads pitch on soldered joint reliability of QFP device with finite element analysis

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

摘要

摘要: 采用有限元方法分别对具有相同引线间距和不同封装类型的QFP器件的焊点残余应力进行了数值模拟计算分析。结果表明,焊点根部、焊趾部位以及引线和焊点交界处为应变集中区域,该三处将可能成为焊点发生破坏区域,在焊点根部的应力值是最大,所以在焊点根部最容易发生破坏。对结果进行分析比较,从应力曲线图可以看出,由于残余应力累积的原因,应力具有迭加性;在引线数目相同的QFP器件中,TQFP64焊点的应力最小,VQFP64次之,SQFP64最大。在引线间距相同的QFP器件中,QFP64焊点的应力最小,QFP44居中,QFP32最大;同时与QFP100比较可知,高密度细间距器件的焊点可靠性更高。
- 有限元 /
- 残余应力 /
- 引线间距 /
- 引线数
Abstract: Finite element method was used to simulate the residual stress in soldered joints of QFP device with the same distance and number of leads, respectively.The results indicated that the stress concentration areas in soldered joint locate at the heel and toe of the soldered joint, as well as at the area between the lead and the soldered joint;the largest value of the stress was in the heel of the soldered joints, which would be the weakest area of the joints. Through the comparison of these results, especially the analysis of stress curves, it was shown that stress increased periodically due to the accumulation of residual stress.In the QFP device with the same number of lead, the stress was increasing in the order:TQFP64< VQFP64
- finite element method /
- residual stress /
- distance of lead /
- number of lead