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Al2O3陶瓷表面化学镀铜工艺及其低温连接

Process of electroless copper plating on Al2O3 ceramics and its soldering at low temperature

  • 摘要: 进行了Al2O3陶瓷表面的化学镀铜处理,制定了前处理流程。研究了硫酸铜浓度、甲醛浓度、施镀温度、施镀时间等对镀层沉积速率的影响,对镀层进行了金相分析,在此基础上得到化学镀铜的优化工艺。进行了镀铜后Al2O3陶瓷低温钎焊工艺试验,研究了不同化学镀工艺条件对接头组织及力学的影响。结果表明,在试验条件下,随着焊接温度升高,接头致密度变差;焊接时间增加,焊缝宽度也增加;硫酸铜,甲醛浓度增加,镀层厚度增加,相对影响了钎焊焊缝宽度和质量。

     

    Abstract: Al2O3 ceramics was treated by electroless copper plating, the surface of Al2O3 pretreatment process was studied. The influence of concentration of liquor of copper sulfate, liquor formaldehyde, temperature and time of plating on the deposition rate were studied.Metallographical analysis of copper plating layer was done, and the optimum process was obtained.Soldering of Al2O3 ceramics after electroless copper plating at low temperature was produced, and the influence of different conditions of electroless plating process on microstructures and mechanical properties of joints was also studied.The results indicate that under the experimental conditions, with the increase of soldering temperature, the tightness of joint becomes worse;and when holding time increases, the soldering seam width will increase too.The increase of both copper sulfate and formaldehyde concentration and the thickness of plating layer relatively affect on the soldering seam width and quality.

     

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