热循环对片式电阻Sn-Cu-Ni-Ce焊点力学性能的影响
Effects of thermal cycling on mechanical property of chip resistor joints soldered with Sn-Cu-Ni-Ce solder
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摘要: 研究了在热循环试验条件下,片式电阻Sn-Cu-Ni-Ce焊点力学性能的变化规律以及不同含量的稀土元素Ce对Sn-Cu-Ni-Ce焊点力学性能的影响。结果表明,随着热循环次数的增加,片式电阻Sn-Cu-Ni-Ce焊点的剪切力逐渐降低;在长时间热循环条件下,焊点开始萌生裂纹,导致焊点可靠性下降。与此同时,添加微量稀土元素Ce可有效提高Sn-Cu-Ni-Ce焊点的力学性能,随着Ce元素含量的增加,焊点的力学性能逐渐提高,当Ce元素含量为0.05%左右时,焊点的力学性能最佳,且在长时间热循环条件下仍然优于其它焊点。Abstract: The influence of thermal cycling on mechanical properties of the chip resistor joints was studied, which soldered with Sn-Cu-Ni-Ce solder, and the effect of rare earth Ce on mechanical properties of the soldered joints was investigated simultaneously.The results indicate that with the increase of thermal cy cling times, the shear forces of the chip resistor joints soldered with Sn-Cu-Ni-Ce solder decreased gradually, and the reliability of soldered joints decreased as well after long time cycling as a result of the existence of crack in soldered joint.The results also show that the shear forces of the joints increase with the addition of Ce, especially when the content of Ce is at about 0.05%, the mechanical property of soldered joint is better than any other soldered joint before and after thermal cycling.
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Keywords:
- lead-free solder /
- thermal cycling /
- mechanical property
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