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侯金保, 张蕾, 魏友辉. IC10合金TLP扩散焊接头组织与强度分析[J]. 焊接学报, 2008, (3): 89-92.
引用本文: 侯金保, 张蕾, 魏友辉. IC10合金TLP扩散焊接头组织与强度分析[J]. 焊接学报, 2008, (3): 89-92.
HOU Jinbao, ZHANG Lei, WEI Youhui. Microstructure and strength analysis of IC10 alloy TLP-DB joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (3): 89-92.
Citation: HOU Jinbao, ZHANG Lei, WEI Youhui. Microstructure and strength analysis of IC10 alloy TLP-DB joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (3): 89-92.

IC10合金TLP扩散焊接头组织与强度分析

Microstructure and strength analysis of IC10 alloy TLP-DB joint

  • 摘要: IC10合金是Ni3Al基金属间化合物材料,对该材料的过渡液相(TLP,transient liquid phase)扩散焊试验进行分析。结果表明,采用合适的中间层和焊接工艺,IC10合金TLP扩散焊接头组织与基体相同,由γ+γ′网状组织和少量碳化物组成,接头980℃持久强度超过128MPa,达到基体强度的80%以上。TLP扩散焊接头经过高温长时间使用后,接头室温、高温抗拉强度与基体更接近;室温抗拉断口以准解理形貌为主,高温抗拉断口以韧窝形貌为主。

     

    Abstract: TLP-DB(transient liquid phase diffusion bonding) experiments were carried out on IC10 alloy, which is one kind of intermetallic compound based on Ni3Al.Experimental results showed that with proper interface layer and welding parameters, microstructure of TLP-DB joints could be the same as the matrix, which consists of γ and γ 'phases.Endurance strengths of the joints under 980℃were above 128 MPa, and had reached 80% of the matrix.Employed for a long time at high temperature, tensile strengths of the joints under room temperature and high temperature were mostly close to the matrix.Fracture of room temperature tensile samples was mainly made up of quasi-cleavage pattern, and fracture of high temperature tensile samples was mainly made up of dimple pattern.

     

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