热-剪切循环条件下Sn3.5Ag0.5Cu/Ni界面化合物生长行为
Growth behavior of compounds at Sn3.5Ag0.5Cu/Ni under thermal-shearing cycling
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摘要: 对热-剪切循环条件下(25~125℃)Sn3.5Ag0.5Cu/Ni界面上原子扩散和化合物的生长行为进行了研究,并将其与恒温时效条件下界面化合物的生长行为进行了比较。结果表明,再流焊后,在Sn3.5Ag0.5Cu/Ni界面上形成(CuxNi1-x)6Sn5化合物;随着热-剪切循环周数的增加,(CuxNi1-x)6Sn5化合物形态从笋状向平面状生长;热-剪切循环200周后,(NixCu1-x)Sn3化合物在(CuxNi1-x)6Sn5化合物周围形成并呈片状快速长大。界面近域的钎料内,颗粒状的Ag3Sn聚集长大成块状。界面金属间化合物的厚度随循环周数的增加而增加,且生长基本遵循抛物线规律,说明Cu原子的扩散控制了(CuxNi1-x)6Sn5化合物的生长。Abstract: The atoms diffusion and growth behavior of intermetallic compound (IMC)at Sn3.5Ag0.5Cu/Ni interface after thermal-shearing cy cling (25-125℃)were investigated, which was compared to compound growth behavior under isothermal aging condition. The results showed that there is a type of (CuxNi1-x)6Sn5 IMC formed at the interface after reflowing, and the morphology of compound changes from scallop-like with the cycling increasing. There is another kind of compound (NixCu1-x)Sn3 formed surrounding (CuxNi1-x)6Sn5 after 200 cycles and grow up rapidly as planarlike.As the thermal-shearing cycling increasing, Ag3Sn formed uniform particles after reflowing congregates to grow up to chunk-like in the solder.The IMC at the interface growth follows a parabolic growth kinetiscs with the thermal-shearing cycling increasing, implying that it was controlled by Cu atom diffusion.
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Keywords:
- thermal-shearing cycling /
- intermetallic compounds /
- solder /
- interface
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