稀土元素Ce对Sn-Cu-Ni无铅钎料铺展性能及焊点力学性能的影响

Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints

摘要: 研究了不同含量稀土元素Ce对Sn-Cu-Ni钎料铺展性能及其焊点力学性能及钎料显微组织的影响规律。结果表明,随着稀土元素Ce含量的增加,钎料在铜基板上的铺展面积逐渐增大,当Ce元素含量达到0.05%时,钎料的铺展面积达到最大。Sn-Cu-Ni钎料中添加适量的稀土元素Ce,能够细化钎料组织,从而提高焊点的力学性能。当Ce元素的含量为0.05%左右时,焊点的力学性能达到最佳值。Ce元素含量超过0.05%后,继续增大稀土元素Ce的添加量,Sn-Cu-Ni钎料的显微组织又变得粗大,铺展性能有所降低,焊点力学性能也随之有所下降。

Abstract: Effects of rare earth Ce on spreadability of Sn-Cu-Ni solder on copper, mechanical properties of soldered joints and the microstructure of Sn-Cu-Ni-Ce solder were investigated respectively.The results indicate that with the increase of the content of Ce added to the Sn-Cu-Ni solder, the spreading area of Sn-Cu-Ni-Ce solder on copper was enlarged.When the content of Ce is about 0.05%, the spreading area is the largest and the microstructure of Sn-Cu-Ni solder is fine and uniform, and the mechanical properties of soldered joints are improved observably.Experimental results also show when the content of Ce is over 0.05%, the grains of the solder gradually become coarse, the spreadability of the solder descend, and the mechanical properties of soldered joints deteriorate as well.