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Ni+Cu为中间层的TC4与ZQSn10-10的扩散连接试验分析

Diffusion bonding of TC4 to ZQSn10-10 with nickel and copper interlayers

  • 摘要: 对钛合金TC4与铜合金ZQSn10-10异种金属扩散连接进行了试验研究。采用Ni+Cu中间层时,其最佳工艺参数为连接温度850℃,连接时间20 min,连接比压力10 MPa,抗拉强度达到155.8 MPa。在TC4/Ni界面上,形成了成分逐渐变化的互扩散层。经微区成分分析可知,连接温度为800℃时,界面主要为Ni3Ti;850℃时,界面主要为Ni3Ti及NiTi;880℃时,界面主要为NiTi2,Ni3Ti及NiTi。通过EDS和XRD分析,接头强度主要取决于镍钛金属间化合物的种类及厚度。

     

    Abstract: The experimental investigation of the diffusion bonding of TC4 to ZQSn10-10 in vacuum was carried out by using pure nickel and copper as the transition metal.Experimental results show that the optimum bonding parameters were selected as follows:bonding temperature 850℃, bonding time 20 min and bonding pressure 10MPa.So the strength of the joint without obvious shape changing was up to 155.8 MPa, which the strength can reach to about 65% of the strength of base metal ZQSn10-10.Various reaction layers appeared in TC4 and Ni interface.When the rest condition was same, Ni3Ti phase was produced at the interface zone at 800℃;and there appeared Ni3Ti and NiTi phases at 850℃;and there produced NiTi2, Ni3Ti and NiTi phases at 880℃.The strength of the joint lied on types and thickness of nickel and titanium intermetallic compounds.

     

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