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Ag-Cu-Ti钎料钎焊金刚石的界面微观组织分析

Microstructure of interface between Ag-Cu-Ti brazing filler metal and diamond

  • 摘要: 在真空炉中采用Ag-Cu-Ti钎料对金刚石磨粒进行了真空钎焊试验,实现了金刚石与钢基体的高强度连接。采用SEM对金刚石与钎料界面、金刚石表面碳化物形貌进行了观察分析,采用EDS分析了金刚石与钎料界面的成分变化,采用Raman对焊后的金刚石结构进行了分析。结果表明,Ag-Cu-Ti钎料中的Ti元素在界面处发生偏析,并在金刚石表面生成尺寸小于1 μm块状TiC,金刚石在焊接过程的高温中没有发生石墨化,最后在界面上形成了金刚石/TiC/钎料/钢基体的梯度结合层。

     

    Abstract: The high-strength bonding between steel matrix and diamond grit was obtained by using Ag-Cu-Ti brazing filler metal in vacuum furnace.The microstructure on the interface between diamond and the filler metal and carbide which was formed on the diamond surface was observed with scanning electron microscope, and the change of components in it was analyzed with energy dispersion spectroscope and the structure of the diamond was analyzed with Raman.Results showed that Ti in Ag-Cu-Ti separated out at the interface to form lump-like TiC carbide on the surface of diamond, which was less than 1 μm in size.Meanwhile, the diamond wasn't graphitized in the high temperature.As a result, the serial of diamond-TiC-filler metal-steel matrix was formed between the interface of the diamond and the filler metal.

     

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