摘要:
用纯金属作中间层TLP连接颗粒增强铝基复合材料,接头存在增强相偏聚区,是接头力学性能的薄弱区域。控制增强相偏聚区是改善接头力学性能的一种有效途径。文中尝试用Cu,Al金属复合中间层TLP连接Al2O3P/6061Al复合材料,探讨了其接头的显微结构和力学性能特点。结果表明,用Cu,Al金属复合中间层能够控制接头增强相偏聚,改善接头抗剪强度。在连接温度600℃,保温时间60 min的工艺条件下,10μm Al/10μm Cu/10μm Al复合中间层接头增强相偏聚明显下降,接头抗剪强度110 MPa;1.5μm Cu/10μm Al/1.5μm Cu复合中间层接头无明显的增强相偏聚,接头抗剪强度123 MPa。
Abstract:
The joint of transient liquid phase bonding of particle reinforced aluminium-based metal matrix composite with a pure metal interlayer contains a particle segregation region, which is deleterious to the joint strength.Decreasing particle segregation is one of effective approaches improving mechanical properties of the joint. The microstructure and mechanical property of aluminium-based metal matrix composite Al2O3P/6061Al joint by transient liquid phase bonding with Al/Cu/Al or Cu/Al/Cu multi-layer interlayer have been investigated.The experimental results show that bonding with the multi-layer interlayer is able to control the particle segregation region and improve the joint strength.Under the bonding condition of 600℃/60 min, with 10 μm Al/10 μm Cu/10 μm Al multi-layer interlayer, the particle segregation region is not evident in the joint, and the shear strength of the joint is 110MPa;with 1.5 μm Cu/10 μm Al/1.5 μm Cu multi-layer interlayer, the particle segregation region is invisible in the joint, and the shear strength of the joint is further increased to 123MPa.
下载:
