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CMT法30CrMnSi钢板表面熔敷CuSi3接头组织结构特征

Microstructure characteristics of CuSi3 cladding on 30CrMnSi steel with cold metal transfer technology

  • 摘要: 利用CMT(cold metal transfer)技术在30CrMnSi钢板表面熔敷CuSi3;采用背散射、能谱分析及X射线衍射等方法对接头区显微组织及成分进行了研究。结果表明,CMT技术实现了熔敷层与基体的冶金结合,送丝速度为5.0 m/min,焊接速度为17.0 mm/s时,稀释率极低;界面区由Fe3Si化合物、α-Fe及ε-Cu组成。送丝速度较低时,界面结构为Fe3Si/α-Fe+ε-Cu/α-Fe,熔敷区出现Fe2Si化合物;提高送丝速度,界面结构为Fe3Si+α-Fe+ε-Cu/α-Fe+ε-Cu,Fe2Si化合物被Fe3Si化合物取代;进一步提高送丝速度,界面结构为α-Fe+ε-Cu,弥散分布的球状富铁相聚合成长为星状及大块团状的α-Fe固溶体。送丝速度的变化对熔敷区组织具有显著影响。

     

    Abstract: A cladding of Cusi3 was deposited on the suface of 30CrMnSi steel by the method of cold metal tromsfor(CMT).The microstructure characteristics and compositions were investigated by back scattered electrons, energy dispersive X-ray spectrometry and X-ray diffractioin.The results show that the metallurgical bond of cladding and base metal is carried out with CMT technology.When wire feeding speed(vs)is 5.0 m min and welding speed is 17 mm s, the rate of dilution is extremely low.Fe3Si, α-Fe, ε-Cu formed in the interface.The interface microstructures are Fe3 Si α-Fe +ε -Cu α-Fe when vs is slow.The feeding speed have a significant influence on the cladding layer.With the increase of vs, the interface microstructure change to Fe3Si +α-Fe +ε-Cu α-Fe +ε- Cu.When vs is high, the structure of α-Fe +ε-Cu is obtained. With the increase of vs, Fe-rich phase in the cladding increased dramatically, gathered and grew from disperse nodular phase to stellated α-Fe solid solution.

     

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