热超声键合换能系统振动多模态分析
Multimode vibration analysis of transducer in thermosonic flip chip bonding
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摘要: 研究了换能系统的振动多模态性及其对键合质量的影响。利用激光多谱勒测振仪提取变幅杆和工具末端各特征点的速度信号,发现换能系统的运动为多种模态耦合的结果,并得到各非主模态与主模态的速度比值,其中非主模态以垂直弯曲振动为主。这种垂直弯曲振动对芯片造成"拍击"的负面效应,从而影响多凸点与基板的键合面积、键合强度以及芯片与基板的平行度。利用FEM方法分析系统多模态产生的原因,并提出抑制方法。Abstract: Multimode vibration of transducer and its effect on bonding quality was investigated.The velocities of different characteristic marks in the horn and bonding tool were acquired up by Laser Doppler Vibrometer.The experimental results showed that the vibration of transducer is the coupling result of different modes.The velocity ratio of non-dominant mode to dominant mode was gained.The longitudinal flexural vibration is the main non-dominant mode.This kind of longitudinal flexural vibration would "flap" the chip, influencing the bonding area, bonding strength and parallel between gold bumps and substrate.The origin of multimode in transducer was analyzed by FEM model, and some suggestions about restraining the non-dominant mode was brought forward.