Ti/Cu/Ti复合中间层扩散连接TiC-Al2O3/W18Cr4V接头组织分析
Microstructure in diffusion bonded TiC-Al2O3 W18Cr4V joint with Ti Cu Ti composite interlayer
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摘要: 通过添加Ti/Cu/Ti复合中间层,控制加热温度1130℃,保温1 h,连接压力15 MPa,实现陶瓷基复合材料TiC-Al2O3与高速钢W18Cr4V的真空扩散连接,TiC-Al2O3/W18Cr4V接头抗剪强度达103 MPa。采用扫描电镜、X射线衍射、电子探针等测试方法分析了TiC-Al2O3/W18Cr4V扩散连接接头的微观组织结构和显微硬度分布。结果表明,Ti/Cu/Ti复合中间层与两侧基体TiC-Al2O3和W18Cr4V发生扩散结合,形成均匀致密、宽度为90μm的扩散过渡区,过渡区显微硬度从3400 HM逐渐降低到1000 HM,形成的相结构主要有Ti3Al,CuTi2,Cu和TiC。Abstract: Diffusion bonding of ceramic matrix composite TiC-Al2O3 and tool steel W18Cr4V was successfully carried out by addition of composite interlayer Ti Cu Ti at 1130℃ for 1 h with a pressure of 15 MPa.Shear strength of the bonded TiC-Al2O3 W18Cr4V joint is 103 MPa. Microstructure characteristics and microhardness in the diffusion bonded TiC-Al2O3 W18Cr4V joint were investigated by means of scanning electron microscope, X-ray diffractometry and electron probe microanalysis.The results indicate that Ti Cu Ti interlayer has been fully diffused to combine with matrixes including TiC-Al2O3 and W18Cr4V and a diffusion transition zone with a thickness of 90μm is formed.The microhardness from TiC-Al2O3 to W18Cr4V across the diffusion transition zone decreases from 3400 HM to 1000 HM. The phases formed in the diffusion transition zone are Ti3Al, CuTi2, Cu and TiC.