高级检索
吴玉秀, 薛松柏, 胡永芳. J形引线焊点可靠性有限元分析[J]. 焊接学报, 2005, (12): 85-88.
引用本文: 吴玉秀, 薛松柏, 胡永芳. J形引线焊点可靠性有限元分析[J]. 焊接学报, 2005, (12): 85-88.
WU Yu-xiu, XUE Song-bai, HU Yong-Fang. Finite element analysis on reliability of soldered joint of J-lead[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (12): 85-88.
Citation: WU Yu-xiu, XUE Song-bai, HU Yong-Fang. Finite element analysis on reliability of soldered joint of J-lead[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (12): 85-88.

J形引线焊点可靠性有限元分析

Finite element analysis on reliability of soldered joint of J-lead

  • 摘要: 采用有限元方法对SOJ(small outline j-lead package)元器件J形引线焊点进行了数值模拟计算分析。结果表明,SOJ元器件焊接后整体变形明显,陶瓷载体有上翘趋势,引线有向外拉伸趋势,PCB板变形较小。J形引线焊点应变最大部位位于焊点根部,焊趾处次之,中心部位最小。J形引线焊点根部应力集中区域较大,存在着最大应力值,为整个焊点最薄弱部位,易发生疲劳破坏。焊趾处应力集中区域比焊点根部小,应力值也稍小,焊点中心部位应力值最小,比焊趾与焊点根部应力值均小一个数量级。计算结果与实际测试结果吻合。

     

    Abstract: Finite element method was used to simulate the soldered joint of J-lead of the SOJ (Small Outline J-lead Package). Results indicate that the distortion is obvious, the ceramic carrier with up-warp trend, the J-lead with forth extension trend, but the PCB with little distortion because of the rigidity displacement restrict. The strain of the J-lead soldered joint' soldered heel is bigger than the soldered toe and the center place has the least strain. The stress of the J-lead soldered heel is bigger than the other place of the soldered joint and the stress distributes a wide area, where is the weakest place of the whole soldered joint, so it is easy to lose efficacy. The stress of the J-lead soldered toe is less than the soldered heel, and the stress distributing area is small. On the contrary, the J-lead soldered joint' center place distributes a large area and the stress value is one order less than the stress value of soldered heel and soldered toe, so it is the safety place of the soldered joint. The calculated values are in agreement with the experimental results.

     

/

返回文章
返回