SnAgCu/Cu和SnAgCu/Au/Ni/Cu表面贴装元件焊点高温存贮试验分析

基金项目: 南京航空航天大学引进人才科研基金项目(S0462-061)

Investigation for SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature

1.
College of Materials Science & Technology, Nanjing University of Aeronautics & Astronautics, Nanjing 210016, China
2.
The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing 210013, China

摘要: 研究了SnAgCu/Cu及SnAgCu/Au/Ni/Cu表面贴装元件焊点在高温存贮试验条件下抗剪强度的变化规律。结果表明,SnAgCu/Cu及SnAgCu/Au/Ni/Cu焊点抗剪强度随保温时间的延长降低,SnAgCu/Cu焊点的抗剪强度高于SnAgCu/Au/Ni/Cu焊点的抗剪强度。SnAgCu/Cu及SnAgCu/Au/Ni/Cu焊点的断口形貌分析表明,断裂大多数都发生在贴装元件端头金属化层内,少数发生在钎料与焊盘的界面以及焊点内部。
- 抗剪强度 /
- SnAgCu钎料 /
- 焊点 /
- 高温存贮
Abstract: Shear strength and fracture photograms of SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature were investigated. Results indicate that the shear strength of SnAgCu/Cu and SnAgCu/Au/Ni/Cu soldered joints decrease with high temperature storage time increasing, and the shear strength of SnAgCu/Cu soldered joint is larger than that of SnAgCu/Au/Ni/Cu soldered joint. Analysis for fracture photograms of SnAgCu/Cu and SnAgCu/Au/Ni/Cu soldered joints indicates that most of the fractures of SnAgCu/Cu and SnAgCu/Au/Ni/Cu soldered joints occurred in the metallic layer of surface mounted components' ends and minority fractures occurred in the solder/pad interface or in the solder.
- shear strength /
- Sn-Ag-Cu solder soldered /
- joint /
- storage at high temperature