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薛松柏, 王旭艳, 禹胜林. SnAgCu/Cu和SnAgCu/Au/Ni/Cu表面贴装元件焊点高温存贮试验分析[J]. 焊接学报, 2005, (12): 62-64.
引用本文: 薛松柏, 王旭艳, 禹胜林. SnAgCu/Cu和SnAgCu/Au/Ni/Cu表面贴装元件焊点高温存贮试验分析[J]. 焊接学报, 2005, (12): 62-64.
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XUE Song-bai, WANG Xu-yan, YU Sheng-lin. Investigation for SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (12): 62-64.
Citation: XUE Song-bai, WANG Xu-yan, YU Sheng-lin. Investigation for SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (12): 62-64.
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SnAgCu/Cu和SnAgCu/Au/Ni/Cu表面贴装元件焊点高温存贮试验分析

Investigation for SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature

    摘要
  • 摘要: 研究了SnAgCu/Cu及SnAgCu/Au/Ni/Cu表面贴装元件焊点在高温存贮试验条件下抗剪强度的变化规律。结果表明,SnAgCu/Cu及SnAgCu/Au/Ni/Cu焊点抗剪强度随保温时间的延长降低,SnAgCu/Cu焊点的抗剪强度高于SnAgCu/Au/Ni/Cu焊点的抗剪强度。SnAgCu/Cu及SnAgCu/Au/Ni/Cu焊点的断口形貌分析表明,断裂大多数都发生在贴装元件端头金属化层内,少数发生在钎料与焊盘的界面以及焊点内部。

     

    Abstract: Shear strength and fracture photograms of SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature were investigated. Results indicate that the shear strength of SnAgCu/Cu and SnAgCu/Au/Ni/Cu soldered joints decrease with high temperature storage time increasing, and the shear strength of SnAgCu/Cu soldered joint is larger than that of SnAgCu/Au/Ni/Cu soldered joint. Analysis for fracture photograms of SnAgCu/Cu and SnAgCu/Au/Ni/Cu soldered joints indicates that most of the fractures of SnAgCu/Cu and SnAgCu/Au/Ni/Cu soldered joints occurred in the metallic layer of surface mounted components' ends and minority fractures occurred in the solder/pad interface or in the solder.

     

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