Ti-6Al-4V/Cu/ZQSn10-10扩散连接
Diffusion bonding of Ti-6Al-4V to ZQSn10-10 with a copper Interlayer
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摘要: 采用纯铜(Cu)箔作中间过渡层在真空下对钛合金Ti-6Al-4V与锡青铜ZQSn10-10异种材料进行扩散连接。用冷场发射扫描电镜对连接接头进行微观分析,用拉伸试验获得接头强度。结果表明,采用铜箔作中间过渡层,可以防止一些低熔点组元的挥发,并且可以阻止某些元素(Sn、Pb等)向钛合金基体扩散,避免更多金属间化合物的产生,从而提高了接头性能。中间过渡层铜与锡青铜ZQSn10-10之间实现了良好的连接,未形成明显的过渡区;在中间过渡层铜与钛合金Ti-6Al-4V之间形成了较宽的过渡区,并有金属间化合物Cu3Ti2产生,对接头性能影响较大。最佳工艺参数是:连接温度为850℃、连接压力为10~15MPa、连接时间为30min,可获得钛合金与锡青铜的牢固连接,接头强度可达192MPa(达到锡青铜母材基体强度的80%),且连接试样无明显变形。Abstract: The experimental investigation of the diffusion bonding of titanium alloy(Ti-6Al-4V) to Tin-bronze (ZQSn10-10) in vacuum was carried out by using pure copper as the transition metal. The microstructure of the joints was studied by SEM、EDS etc. and their mechanical properties were tested by tensile experiments. Experimental results show that using copper as interlayer, it can not only avoid some elements(Sn、Pb etc.) volatilizing but also prevent unwanted elements from diffusion. So the properties of joint can be improved by avoiding more intermetallic compound. The bonding of ZQSn10-10 to copper as interlayer metal is well formed, which intergradation zone can not obviously developed, but the intergradation zone well develop between copper and titanium alloy which intermetallic compound Cu3Ti2 concomitantly appear. The optimum bonding parameters were:bonding temperature T=850℃,bonding pressure P=10~15 MPa and bonding time t=30 min. So the strength of the joint without obvious shape change was up to 192MPa reaching to about 80% of the strength of base metal ZQSn10-10.