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胡永芳, 薛松柏, 禹胜林. QFP结构微焊点强度的试验[J]. 焊接学报, 2005, (10): 78-80.
引用本文: 胡永芳, 薛松柏, 禹胜林. QFP结构微焊点强度的试验[J]. 焊接学报, 2005, (10): 78-80.
shu
HU Yong-fang, XUE Song-bai, YU Sheng-lin. Study on strength of soldered micro-joints of QFP devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 78-80.
Citation: HU Yong-fang, XUE Song-bai, YU Sheng-lin. Study on strength of soldered micro-joints of QFP devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 78-80.
shu

QFP结构微焊点强度的试验

Study on strength of soldered micro-joints of QFP devices

    摘要
  • 摘要: 采用微焊点强度测试仪(STR-1000型)测试了方形扁平式封装器件(QFP)的抗拉强度,并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。研究结果表明,在相同的钎料成分下,焊脚间距越大,所需的抗拉力越大,抗拉强度越高;共晶钎料QFP焊点的抗拉强度比纯铅的抗拉强度低,QFP焊点的结合强度比钎料自身的抗拉强度高。

     

    Abstract: Tensile strength of the quad flat pack(QFP) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP(small outline package).The results indicate that for the same solder compositions,the wider the pitch is,the larger the pulling force is,i.e.the higher the tensile strength is.The tensile strength of soldered joints of QFP with pure lead is higher than that of eutectic solder and as well and as higher than that of eutectic solder itself.

     

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