BGA封装器件焊点抗剪强度的试验

Study on shear strength of soldered joints of BGA packaging devices

摘要: 采用微焊点强度测试仪研究了Sn-Pb共晶钎料BGA(球栅阵列封装技术)封装器件焊点的抗剪强度,并对不同直径的BGA球焊点的抗剪强度进行了比较。研究结果表明,在相同条件下,BGA球直径越大,抗剪强度越小;共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。

Abstract: Shear strength of BGA packaging device joints with Sn-Pb eutectic solder were studied in the paper using Micro-joints Strength Tester,and compared BGA joints shear strength with different diameters.The results indicate that in the same conditions,the bigger BGA diameter is,the smaller the shear strength is.The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.