TC4/Ni/QAl10-3-1.5扩散连接研究

基金项目: 国家自然科学基金资助项目(50375065);国防重点实验室资助项目

Diffusion bonding of TC4/Ni/QAl10-3-1.5

1.
School of Material, Jilin University, Changchun 130025, China
2.
State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

摘要: 采用Ni箔做中间层在真空下对TC4和QA l10-3-1.5进行扩散连接,用冷场发射扫描电镜(JEOL JSM 6700F)对焊接接头进行金相和能谱分析,用X射线衍射进行相分析,并进行硬度试验和接头拉伸试验。结果表明,在连接温度870℃,连接压力10MPa,保温时间60 min规范下,Ni做中间层能够实现TC4和QA l10-3-1.5扩散连接,其抗拉强度达到325 MPa。扩散连接界面形成了不同的分层结构,由形成了NiTi相,(NiTi+Ni₃Ti)相和Ni(Cu)固溶体构成的扩散反应层。
- 扩散连接 /
- 钛合金 /
- 铜合金 /
- Ni中间层 /
- 显微组织
Abstract: TC4 and QAl10-3-1.5 were diffusion-bonded with Ni interlayer. The diffusion-bonded joints were evaluated by scanning electron microscopy(JEOL JSM6700F) and its attaching energy dispersive spectroscopy(EDS). Intermetallic compounds at the interface were detected vie X-ray diffraction(XRD) and microhardness tests and tensile testings were done to evaluate the properties of bond joints. The results indicated that TC4 and QAl10-3-1.5 with Ni interlayer were bonded firmly under the condition of 870℃ temperature,10MPa bond stress and 60min holding time, and the bond strength was up to 325MPa, furthermore, various reaction bands appeared in the diffusion zone,and NiTi phase,(NiTi+ Ni₃Ti)phase and Ni(Cu) solid solution were produced at the interface zone.
- diffusion bonding /
- titanium alloy /
- copper alloy /
- Ni interlayer /
- microstructure