Sn-Ag-Cu-Ce无铅钎料合金体系的热力学计算及预测

Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system

摘要: 利用周模型对Sn-Ag-Cu-Ce无铅钎料合金体系进行了热力学计算预测。热力学计算结果表明,Ag、Cu含量(质量分数)分别为0.5%~4.5%时,当Ce的含量(质量分数)超过0.05%时,体系达到化学平衡状态;当Ce的含量(质量分数)达到0.6%左右时,Sn、Ag、Cu分别都出现了"等活度系数"现象。这一研究结果可为无铅钎料合金的成分设计提供理论指导。
- 无铅钎料 /
- 周模型 /
- 化学平衡 /
- 等活度系数
Abstract: Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.The results showed that chemical balance attained in the system of Sn(rest) Ag(0.5 wt.%-4.5 wt.%) Cu(0.5 wt.%-4.5 wt.%) when the content of Ce was over 0.05wt.%.The equivalent activity coefficient phenomenon of Sn,Ag and Cu emerged in the system when the content of Ce increased to about 0.6wt.%.The results will provide theoretical guidance for designing chemical constitutions of new lead-free solders.
- lead-free solders /
- Chou model /
- chemical balance /
- equivalent activity coefficient