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DD6单晶合金过渡液相扩散焊工艺

Transient liquid phase diffusion bonding of a single crystal superalloy DD6

  • 摘要: 对国内自行研制的第二代单晶合金DD6的过渡液相扩散焊(TLP扩散焊)工艺进行了研究。所采用中间层合金的主要成分与DD6母材基本一致,同时加入一定量的B作为降熔元素。试验结果表明,在文中的试验条件下,很难获得微观组织与DD6母材完全一致的TLP扩散焊接头。1290℃/12h规范扩散焊接头的连接界面,约一半区域为与DD6母材类似的γ+γ'组织,其它区域则为γ固溶体基体上分布着不同形态的硼化物,其980℃的持久性能接近母材性能指标的90%。延长扩散焊保温时间至24h,连接界面上的不均匀区域减少,其980℃及1100℃的持久性能分别达母材性能指标的90%~100%和70%~80%。

     

    Abstract: DD6 alloy was bonded by transient liquid phase(TLP) diffusion bonding.The main compositions of the interlayer alloy were similar to those of the DD6,base metal,and a certain amount of element B was added as the melting point depressant.The results show that it is difficult to obtain the joints with the microstructures completely homogeneous.For the joint TLP diffusion bonded at 1 290 ℃ for 12 h,about half areas of the beam possessed a γ+γ' microstructure,nearly identical with that of the base metal,and the other local areas consisted of γ-solution,borides,etc.Prolonging the bonding time to 24 h,the inhomogeneous areas in the joint reduced,and the joint property improved.The joint stress-rupture strength at 980 ℃ and 1 100 ℃ reached 90%-100% and 70%-80% of those of the base metal respectively.

     

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