Abstract: A new high temperature creep strain equipment was used to test materials for the micro-electronic technology and soldered joints.Based the Dorn equation measurements were conducted on 63Sn37Pb joints for confirming the creep parameters,i.e.,stress exponent,creep activation energy and constant.The final constitutive equation for the soldered joints was established,which demonstrated the dependence of steady-state creep rate on the stress and temperature.Results showed that the stress exponent and creep activation energy are lower than those of soldered joints,which means that the creep resistance of 63Sn37Pb soldered joints is better than that of solder.This is to say,the creep behavior of solder itself don't deducted one of soldered joints.