Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4二次部分瞬间液相连接强度

邹家生; 许志荣; 初亚杰; 赵其章

Si₃N₄/Ti/Cu/Ni/Cu/Ti/Si₃N₄二次部分瞬间液相连接强度

江苏科技大学材料科学与工程学院, 江苏镇江, 212003

基金项目: 江苏省自然科学基金项目(BK2001087)、(BK2003045)

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- 收稿日期: 2004-09-17

Bonding strength of double partial transient liquid phase bonding with Si₃N₄/Ti/Cu/Ni/Cu/Ti/Si₃N₄

East China Shipbuilding Institute, Zhenjiang 212003, Jiangsu, China

摘要

摘要: 采用Ti/Cu/Ni中间层对Si₃N₄陶瓷进行二次部分瞬间液相(PTLP)连接,研究连接工艺参数对Si₃N₄/Ti/Cu/Ni连接强度的影响,同时研究了连接强度随试验温度的变化规律。结果表明,在该试验条件下,室温连接强度随着二次连接温度的提高和二次保温时间的延长而提高,改变连接工艺参数对Si₃N₄/Ti/Cu/Ni二次PTLP连接界面反应层厚度无明显影响;连接强度在试验温度400℃时达到最大,随后随试验温度升高,连接强度降低,但在800℃前,其高温强度具有很好的稳定性。
- 氮化硅 /
- 二次部分瞬间液相连接 /
- 连接强度 /
- 高温强度
Abstract: The influence of bonding parameters and testing temperature on bonding strength was studied under double partial transient liquid phase(PTLP) bonding with Si₃N₄ ceramic using Ti/Cu/Ni inter-layer.The results showed that the bonding strength at room temperature increases with second bonding temperature and second holding time,and bonding parameters have slight influence on thickness of reaction layer in Si₃N₄/Ti/Cu/Ni interface of double PTLP bonding.The bonding strength was the highest at testing temperature 400℃,and the bonding strength declined when the temperature continued to increase.But the high temperature strength had good stability if the temperature was less than 800℃.
- silicon nitride /
- double partial transient liquid phase bonding /
- bonding strength /
- high temperature strength

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文章访问数: 312
HTML全文浏览量: 12
PDF下载量: 68
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Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4二次部分瞬间液相连接强度

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出版历程

Bonding strength of double partial transient liquid phase bonding with Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4

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出版历程

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Si₃N₄/Ti/Cu/Ni/Cu/Ti/Si₃N₄二次部分瞬间液相连接强度

Bonding strength of double partial transient liquid phase bonding with Si₃N₄/Ti/Cu/Ni/Cu/Ti/Si₃N₄