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铜基钎料钎焊SiC/Nb的接头组织及强度

Microstructure and strength of SiC/Nb joint with Cu based brazing filler metal

  • 摘要: 为了连接SiC陶瓷与铌合金,用铜基钎料对SiC陶瓷与金属铌进行了钎焊,并对接头的微观组织、形成机理和高温强度进行了研究。结果表明,使用铜基钎料可以实现SiC陶瓷和铌合金的连接。且在试验温度范围内,接头强度随钎焊温度升高呈上升趋势。通过扫描电子显微镜观察,钎料与SiC陶瓷钎焊接头明显分层,存在一层较厚的过渡层,性质介于金属与陶瓷之间。获得这种层状结构对缓和焊接残余应力十分有利,500℃下,三点弯曲强度试验测试达290MPa。

     

    Abstract: SiC ceramic was bonded to Nb alloy using Cu basedbrazing filler metal at temperatures,from 1 045℃ to 1 101℃ for 300 s in vacuum.The microstructure and high temperature strength of the joint were investigated.The high temperature strength of the joint increased with the increasing of brazing temperature.The diffusion layer which con-sists of Cu and C solid solution could be observed by scanning electronmicroscope.The diffusion layer could relieve the stress which had beenproduced during cooling.The three point bending strength of the joint canget to 290MPa at 500℃.

     

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